How we prepare sample for root cause failure investigations
Failure Analysis Investigation The root cause of a failure in many devices, especially semiconductor and electronics, is internal to the device, which requires cross sectioning or slope cutting. Ion milling removes layers without creating additional damage, and multiple areas with differing amounts of material removed is possible. Microstructures of joints in semiconductor devices can be […]
How we prepare thin films for electronics, semiconductors and biological materials.
Cross Sectioning & Slope Cutting with Ion Milling Delicate materials in Electronics, semiconductors, and biological materials, and thin films used in any application can easily be damaged by mechanical cutting. Mounting required before cutting can also present a problem with the positioning of the sample, and the resulting cross section may not be perfectly perpendicular. […]
How we prepare samples for Electron Backscatter Diffraction (EBSD) measurements
Oxide Layer Removal with Ion Milling Performing EDS on a oxidized material results in poor data, as the oxide layer will obscure and mix with the data from the underlying bulk material which is typically of most interest. Ion milling removes the top oxidation layer giving accurate EDS quantification of the materials. The analysis can […]
