How we prepare sample for root cause failure investigations

Failure Analysis Investigation

The root cause of a failure in many devices, especially semiconductor and electronics, is internal to the device, which requires cross sectioning or slope cutting.  Ion milling removes layers without creating additional damage, and multiple areas with differing amounts of material removed is possible.  Microstructures of joints in semiconductor devices can be investigated at various levels into the device to see any voids, cracks, metal diffusion/migration at interlayer for joint quality.


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